半导体减薄砂轮Semiconductor Thinner Grinding Wheel

  • 发布时间:2019-10-01
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半导体减薄砂轮Semiconductor Thinner Grinding Wheel(图1)

减薄砂轮主要应用于半导体晶圆的减薄与精研加工。我公司生产的减薄砂轮可替代进口产品,在日本、德国、美国、韩国及国产磨床上稳定使用,砂轮磨削性能优越,性价比高。

Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.

Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.

 

加工对象:分立器件、集成电路衬底及原始晶片等。

工件材料:单晶硅、砷化镓、磷化铟、碳化硅等半导体材料。

应用工序:背面减薄、正面磨削的粗磨加工和精研加工。

Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Applications: back thinning, rough grinding and fine grinding.

半导体减薄砂轮Semiconductor Thinner Grinding Wheel(图2)

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